Biography

Peter Gadfort earned his Bachelor of Science in Electrical and Computer Engineering in 2008, his Master of Science in Electrical Engineering focusing on low power driver and interconnect technologies and advanced packaging of systems on packages in 2009, and his Doctor of Philosophy in Electrical Engineering from North Carolina State University, Raleigh, NC, USA, in 2014. He was with the Information Sciences Institute, University of Southern California, Arlington, VA, USA. He is currently with the US Army Research Laboratory. His current research interests include 2.5 and 3-D packaging and integration and energy efficient electronics.

Research Interests

• 3D packaging and integrated circuits (3DIC)
• Multi-chip modules (MCM) and system in packages (SoP/SiP)
• Very-large-scale integration (VLSI)
• Low power / energy starved circuits (ULP)
• Micro sensors / Internet of Things (IoT)
• RF energy harvesting (Energy Harvesting)

Education

• Doctor of Philosophy, Electrical Engineering, NC State University, 2014
  Packaging and Integration of Three Dimensional Microsensors (Advisor: Paul Franzon)
• Master of Science, Electrical Engineering, NC State University, 2009
  Low Power Interconnect Circuits using Silicon Carriers (Advisor: Paul Franzon)
• Bachelor of Science, Electrical and Computer Engineering, NC State University, 2008
  Minor, Mathematics, NC State University, 2008